this is information on a product in full production. december 2013 docid025068 rev 2 1/8 stps640c-y automotive power schottky rectifier datasheet ? production data features ? low forward voltage drop ? very small conduction losses ? negligible switching losses ? extremely fast switching ? low thermal resistance ? aec-q101 qualified. description this dual schottky rectifier is designed for switch mode power supplies and other power converters. this device is intended for use in low and medium voltage operation, and in particular high frequency circuits where low switching losses are required (free wheeling and polarity protection) in automotive applications. a1 a2 k a2 a1 k dpak STPS640CBY-TR table 1. device summary symbol value i f(av) 2 x 3 a v rrm 40 v t j 150 c v f (typ) 0.50 v www.st.com
characteristics stps640c-y 2/8 docid025068 rev 2 1 characteristics when the diodes 1 and 2 are used simultaneously : tj(diode 1) = p(diode1) x r th(j-c) (per diode) + p(diode 2) x r th(c) to evaluate the conduction losses use the following equation: p = 0.42 x i f(av) + 0.050 x i f 2 (rms) table 2. absolute ratings (limiting values, per diode) symbol parameter value unit v rrm repetitive peak reverse voltage 40 v i f(rms) forward rms current 6 a i f(av) average forward current, = 0.5, t c = 135 c per diode 3 a per device 6 i fsm surge non repetitive forward current t p = 10 ms sinusoidal, t c = 25 c 75 a i rrm peak repetitive reverse current t p = 2 s, f = 1khz 1 a p arm repetitive peak avalanche power t p = 1 s, t c = 25 c 1300 w t stg storage temperature range -65 to +150 c t j operating junction temperature -40 to +150 c table 3. thermal parameters symbol parameter value unit r th(j-c) junction to case per diode 5.5 c/w per device 3 r th(c) coupling 0.5 table 4. static electrical characteristics (per diode) symbol parameter test conditions min. typ max. unit i r (1) reverse leakage current t j = 25 c v r = v rrm - - 100 a t j = 125 c - 2 10 ma v f (2) forward voltage drop t j = 25 c i f = 3 a - - 0.63 v t j = 125 c - 0.50 0.57 t j = 25 c i f = 6 a - - 0.84 t j = 125 c - 0.67 0.72 1. pulse test: t p = 5 ms, < 2% 2. pulse test: t p = 380 s, < 2%
docid025068 rev 2 3/8 stps640c-y characteristics 8 figure 1. average forward power dissipation versus average forward current (per diode) figure 2. average forward current versus ambient temperature ( = 0.5, per diode) 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 0.00 0.25 0.50 0.75 1.00 1.25 1.50 1.75 2.00 2.25 2.50 p f(av) (w) p f(av) (w) t = tp/t tp i f(av) (a) i f(av) (a) = 0.05 = 0.1 = 0.2 = 0.5 = 1 0 25 50 75 100 125 150 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 i(a) f(av) t (c) amb r th(j-a) = r th(j-c) r th(j-a) = 15 c/w t = tp/t tp 0.001 0.01 0.1 0.01 1 0.1 10 100 1000 1 t (s) p p(t) arm p p (1s) arm 0 0.2 0.4 0.6 0.8 1 1.2 25 50 75 100 125 150 t (c) j p(t) arm p p (25c) arm figure 5. relative variation of thermal impedance junction to case versus pulse duration figure 6. reverse leakage current vs. reverse voltage applied (typical values, per diode) 1e-3 1e-2 1e-1 1e+0 0.0 0.2 0.4 0.6 0.8 1.0 z/r th(j-c) th(j-c) t =tp/t tp t (s) p = 0.5 = 0.2 = 0.1 single pulse 0 5 10 15 20 25 30 35 40 1e-5 1e-4 1e-3 1e-2 i (a) r v (v) r t j = 150 c t j = 100 c t j = 75 c t j = 125 c
characteristics stps640c-y 4/8 docid025068 rev 2 figure 9. thermal resistance junction to ambient versus copper surface under tab figure 7. junction capacitance vs. reverse voltage applied (typical values, per diode) figure 8. forward voltage drop vs. forward current (per diode) 12 51020 50 10 100 500 c(pf) v (v) r f = 1 mhz v = 30 mv osc rms t = 25 c j 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 0.1 1.0 10.0 i(a) fm v(v) fm t j = 25c (maximum values) t j = 150c (typical values) 30 40 50 60 70 80 r (c/w) th(j-a) 0 4 8 12 16 20 24 28 32 36 40 0 10 20 s(cu)(cm2) epoxy printed circuit board fr4, copper thickness = 35 m
docid025068 rev 2 5/8 stps640c-y package information 8 2 package information ? epoxy meets ul94,v0 ? lead-free packages in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions and product status are available at: www.st.com . ecopack ? is an st trademark. figure 10. dpak dimension definitions h l4 g b l2 e b2 d a1 r r c a c2 0.60 min. v2 a2
package information stps640c-y 6/8 docid025068 rev 2 figure 11. footprint dimensions in mm (inches) table 5. dpak dimension values ref. dimensions millimeters inches min. typ. max. min. typ. max. a 2.20 2.40 0.086 0.094 a1 0.90 1.10 0.035 0.043 a2 0.03 0.23 0.001 0.009 b 0.64 0.90 0.025 0.035 b2 5.20 5.40 0.204 0.212 c 0.45 0.60 0.017 0.023 c2 0.48 0.60 0.018 0.023 d 6.00 6.20 0.236 0.244 e 6.40 6.60 0.251 0.259 g 4.40 4.60 0.173 0.181 h 9.35 10.10 0.368 0.397 l2 0.80 typ. 0.031 typ. l4 0.60 1.00 0.023 0.039 v2 0 8 0 8 6.7 6.7 3 3 1.6 1.6 2.3 2.3
docid025068 rev 2 7/8 stps640c-y ordering information 8 3 ordering information 4 revision history table 6. ordering information order code marking package weight base qty delivery mode STPS640CBY-TR stps640cy dpak 0.3 g 2500 tape and reel table 7. revision history date revision changes 6-nov-2013 1 first issue 04-dec-2013 2 properties changed from preliminary data to production data.
stps640c-y 8/8 docid025068 rev 2 please read carefully: information in this document is provided solely in connection with st products. stmicroelectronics nv and its subsidiaries (?st ?) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described he rein at any time, without notice. all st products are sold pursuant to st?s terms and conditions of sale. purchasers are solely responsible for the choice, selection and use of the st products and services described herein, and st as sumes no liability whatsoever relating to the choice, selection or use of the st products and services described herein. no license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. i f any part of this document refers to any third party products or services it shall not be deemed a license grant by st for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoev er of such third party products or services or any intellectual property contained therein. unless otherwise set forth in st?s terms and conditions of sale st disclaims any express or implied warranty with respect to the use and/or sale of st products including without limitation implied warranties of merchantability, fitness for a particular purpose (and their equivalents under the laws of any jurisdiction), or infringement of any patent, copyright or other intellectual property right. st products are not designed or authorized for use in: (a) safety critical applications such as life supporting, active implanted devices or systems with product functional safety requirements; (b) aeronautic applications; (c) automotive applications or environments, and/or (d) aerospace applications or environments. where st products are not designed for such use, the purchaser shall use products at purchaser?s sole risk, even if st has been informed in writing of such usage, unless a product is expressly designated by st as being intended for ?automotive, automotive safety or medical? industry domains according to st product design specifications. products formally escc, qml or jan qualified are deemed suitable for use in aerospace by the corresponding governmental agency. resale of st products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by st for the st product or service described herein and shall not create or extend in any manner whatsoev er, any liability of st. st and the st logo are trademarks or registered trademarks of st in various countries. information in this document supersedes and replaces all information previously supplied. the st logo is a registered trademark of stmicroelectronics. all other names are the property of their respective owners. ? 2013 stmicroelectronics - all rights reserved stmicroelectronics group of companies australia - belgium - brazil - canada - china - czech republic - finland - france - germany - hong kong - india - israel - ital y - japan - malaysia - malta - morocco - philippines - singapore - spain - sweden - switzerland - united kingdom - united states of america www.st.com
|
